Nvidia Looks to Accelerate Production With New Packaging Tech

Nvidia Looks to , Accelerate Production , With New Packaging Technology.

Yahoo Finance reports that Nvidia Corp has announced plans to use Fan-Out Panel Level Packaging (FOPLP) technology to package its GB200 AI server chips.

The change was reportedly made to address production constraints on the currently used Chip on Wafer Substrate (CoWoS) packaging used at the Taiwan Semiconductor Manufacturing Company.

The change was reportedly made to address production constraints on the currently used Chip on Wafer Substrate (CoWoS) packaging used at the Taiwan Semiconductor Manufacturing Company.

According to industry experts, FOPLP could be a viable alternative to CoWoS amid the increasing demand for AI chips.

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Analysts consider Nvidia the premier accelerated compute and generative AI supplier, backed by production plans with Blackwell Chip.

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Over the past year, stock in Nvidia has gained over 184%.

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On May 29, shares in Nvidia were up 0.89% at $1,149.10 in premarket trading.

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Yahoo Finance reports that a growing number of packaging companies are getting ready to offer FOPLP services.

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Yole Group has predicted that its market share will increase from 2% in 2022 to 8% by the year 2028.

The gains are expected to primarily be driven by higher yields and increasing cost efficiency.

Experts point out that while FOPLPs could reduce cost and expand capacity, they have weaker technical specifications compared to the current CoWoS standard